ERDI LASER
Compact 1535nm Laser Module, 35x8x6.8mm, Eye-Safe
Compact 1535nm laser modules from 35x8x6.8mm for handheld rangefinders and UAV payloads: weight, power draw, interface options and datasheets.
What "compact" means in this range
Every model here is a microchip transmitter: the gain medium, the Q-switch and the resonator are one bonded assembly, so there is no separate cavity to align and no optical bench to mount. What changes across the range is the package the assembly is built into, and with it the energy the unit can dissipate.
Three numbers describe compactness better than any adjective: the package length, the mass, and the supply the driver needs. All three are published per model, and they move together.
Package and mass by model
| Model | Package | Weight | Pulse energy | Repetition rate | Supply / peak current |
|---|---|---|---|---|---|
| MINI-100 | 14.5×6.3×4.37 | 2.5 g | ≥100 µJ | 1–10 Hz | 2 V / 12 A |
| ER10 | micro, 6 g (see datasheet) | 6 g | ≥10 µJ | 5 kHz | 2 V / 5 A |
| ER20 | micro, 6 g (see datasheet) | 6 g | ≥20 µJ | 2.5 kHz | 2 V / 5 A |
| ER40 | micro, 6 g (see datasheet) | 6 g | ≥40 µJ | 1 kHz | 2 V / 5 A |
| ER70 | micro, 6 g (see datasheet) | 6 g | ≥70 µJ | 500 Hz | 2 V / 5 A |
| ER100 | 21×8×6.8 | 7 g | ≥100 µJ | 1–10 Hz | 2 V / 8 A |
| ER200 | 21×8×6.8 | 7 g | ≥200 µJ | 1–10 Hz | 2 V / 10 A |
| ER300 | 25×8×6.8 | 8.5 g | ≥300 µJ | 1–10 Hz | 2 V / 12 A |
| ER400 | 35×8×6.8 | 12 g | ≥400 µJ | 1–10 Hz | 2 V / 15 A |
| ER500 | 35×8×6.8 | 12 g | ≥500 µJ | 1–10 Hz | 2 V / 20 A |
| ER800 | 40×8×7.5 | 18 g | ≥800 µJ | 1–10 Hz | 2 V / 30 A |
| ER900 | 40×8×7.5 | 18 g | ≥900 µJ | 1–5 Hz | 2 V / 30 A |
Where a package dimension is not published in this table it is because the outline drawing is the authority — the package dimensions page lists the drawings, and each product page carries its own datasheet link.
The smallest unit is not the weakest one
MINI-100 is the smallest package in the range at 2.5 g and 14.5 mm long, and it still delivers 100 µJ in a 3.5 ns pulse. That combination exists because the microchip resonator scales down without losing pulse energy to the same degree as a conventional cavity: the beam waist is defined by the bonded assembly, not by a pair of mirrors that have to be aligned and held.
The 6 g high-repetition models are the other extreme: 10–70 µJ per pulse, but at 500 Hz–5 kHz. They are compact in a different sense — short, light, and on a 2 V rail — which is what a scanning head or a gimbal needs. The high repetition rate page covers the energy–rate trade for those four.
What sets the package size
Two things: the pump energy that has to be stored, and the heat that has to leave. Energy per pulse scales the crystal and the pump diode, so a 10 mJ transmitter cannot be built in a 12 g housing. Heat sets the duty cycle the package can sustain, which is why the 6 g models pair high repetition rate with modest energy while the 18 g models pair 1–10 Hz with 800–900 µJ.
Practical consequences for a design:
- Voltage stays at 2 V for every model up to ER900. The constraint that changes across the compact families is peak current (5–30 A), not voltage — which means the driver topology can stay the same and only the storage capacitor and switch change.
- Current rises faster than energy. ER100 runs 8 A at 100 µJ; ER800 runs 30 A at 800 µJ. A board designed for 10 A cannot reach the top of the compact range without a change to the discharge path.
- Length, not width, is what grows. The compact package cross-section stays near 8 × 7 mm from ER100 to ER900; the length goes from 21 mm to 40 mm. That is the dimension to reserve in an enclosure.
Mounting and alignment in a small housing
At these sizes the mechanical interface matters as much as the optics. Three points from integration work:
- Do not clamp on the window. The output window is the most fragile feature of the package; a clamp that loads it will shift the beam or crack the seal.
- Allow for the lead bend. The electrical leads are part of the outline drawing; a bend radius that is too tight loads the solder joint inside the package.
- Alignment after assembly is not adjustable. The beam direction is set by the package, so the mount has to provide the pointing adjustment, not the laser.
The package dimensions page covers this in more detail, including what the outline drawings do and do not specify.
Where the compact family is used
Handheld rangefinders, monocular and binocular products, small gimbals, UAV sensor heads, and any design where the laser has to fit inside a product that is already defined. The rangefinder selection page covers how energy and supply narrow the model once the package is fixed, and the LiDAR page covers the scanning case.
Narrowing it down
Send the envelope you can spare, the mass budget, and the supply on the board. Those three usually leave one or two models; the RFQ guide lists what else is useful.
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